Samsung 5 G Chipsets
Samsung Electronics has launched new chipsets that will be embedded into the company’s next-generation 5 G solutions. The new 3GPP Rel.16 compliant chipsets consist of a third-generation mmWave Radio Frequency Integrated Circuit (RFIC) chip. a second-generation 5G modem System on- Chip (SoC) and a Digital Front End (DFE)-RIC integrated chip. It will be embedded in units shipped in 2022 including next-gen 5G Compact Macro, Massive MIMO radios and baseband units. “Samsung’s long-standing expertise in developing chipsets in-house is a key differentiator, positioning it as a leader in the delivery of 5G network solutions with the features and benefits operators seek to advance their 5G strategies,” Anshel Sag, Moor Insights & Strategy said.