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July 12, 2021 Monday 01:48:31 PM IST

Samsung 5 G Chipsets

Technology Inceptions

Samsung Electronics has launched new chipsets that will be embedded into the company’s next-generation 5 G solutions. The new 3GPP Rel.16 compliant chipsets consist of a third-generation mmWave Radio Frequency Integrated Circuit (RFIC) chip. a second-generation 5G modem System on- Chip (SoC) and a Digital Front End (DFE)-RIC integrated chip. It will be embedded in units shipped in 2022 including next-gen 5G Compact Macro, Massive MIMO radios and baseband units. “Samsung’s long-standing expertise in developing chipsets in-house is a key differentiator, positioning it as a leader in the delivery of 5G network solutions with the features and benefits operators seek to advance their 5G strategies,” Anshel Sag, Moor Insights & Strategy said.

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