More Heat Resilient Silver Circuitry
Researchers at Michigan State University (MSU) have developed a more heat resilient silver circuitry with an assist from nickel that can withstand extreme conditions. The new devices are meant to work for next generation fuel cells, high-temperature semiconductors and solid oxide electrolysis cells. These could have applications in the auto, energy and aerospace industries. To become commercially successful, these devices have to maintain their performance in high temperatures over longer periods of time, according to Jason Nicholas, Associate Professor of Engineering. The team has found a solution to ensure better adhesion of silver to the underlying ceramic components in a circuitry by adding an intermediate layer of porous nickel between the silver and the ceramic. The nickel not only withstands the extreme heat with a melting point of 1,455 degrees, it also distributes the liquified silver uniformly over its fine features using what's called capillary action.
Published in Pallikkutam June ((Subscribe)